Golden Altos Corporation
Serving the semiconductor, military and aerospace industries since 1984

MIL-STD-883 Qualification Testing

MIL-STD-883 Testing

Environmental Tests

  • Moisture Resistance (Method 1004)

  • Steady State Life (Method 1005)

  • Salt Atmosphere Corrosion (Method 1009)

  • Temperature Cycling (Method 1010)

  • Thermal Shock (Method 1011)

  • Seal, Fine and Gross Leak Test (Method 1014)

  • Burn-In Test (Method 1015)

  • Internal Water Vapor Content (Method 1018)

Mechanical Tests

  • Constant Acceleration (Method 2001)

  • Mechanical Shock (Method 2002)

  • Solderability (Method 2003)

  • Lead Integrity (Method 2004)

  • Vibration Variable Frequency (Method 2007)

  • Bond Strength Destructive Bond Pull Test (Method 2011)

  • Resistance to Solvents (Method 2015)

  • Physical Dimensions (Method 2016)

  • Die Shear Strength (Method 2019)

  • Particle impact Noise Detection Test (Method 2020)

  • Lid Torque for glass-fit-sealed packages (Method 2024)

  • Adhesion of Lead Finish (Method 2025)

  • Random Vibration (Method 2026)

Group B Tests

  • For Class B Devices

    • Subgroup 2 – Resistance to Solvent

    • Subgroup 3 – Solderability

    • Subgroup 5 – Bond Strength

  • For Class S Devices

    • Subgroup 1 – Physical Dimension, Water Vapor Content

    • Subgroup 2 – Resistance to Solvent, Internal Visual & Mechanical Bond Strength, Substrate Attach

    • Subgroup 3 – Solderability

    • Subgroup 4 – Lead Integrity, Fine Leak, Gross Leak, Lid Torque

    • Subgroup 5 – Steady State Life

    • Subgroup 6 – Temperature Cycle, Constant Acceleration, Fine Leak, Gross Leak

Group C Tests

  • Sub-group 1A

Group D Tests

  • Sub-group 1

  • Sub-group 2

  • Sub-group 3

  • Sub-group 4

  • Sub-group 5

  • Sub-group 6

  • Sub-group 7

  • Sub-group 8