Summary of Position
Work closely with Production, Engineering, Quality and Customer Service. This involves designing of new production tools with Engineering, training of operators on new processes and tooling use. Proper documentation of new processes. And timely delivery of products to customers by eliminating process issues with production.
Must possess knowledge of Military specifications used in the manufacturing of semiconductor components such as MIL-STD-202, MIL-STD-750, MIL-STD-883, MIL-PRF-38535 and other related specifications.
Hands on clean room assembly experience from wafer saw to package seal; Hands on non-clean room assembly experience such as mark, trim, solder, fine and gross leak.
Ability to identify assembly process rejects and root causes. This may involve, failure analysis using both internal sources and outside services such as X-ray, SEM, FTIR and others. Data analysis, SPC, FMEA and other industry standard methods.
Ability to work with customers on technical issues and give advice. Issues may involve the development of new processes for hybrid assembly, package selection and layout based proposed bonding diagram, Materials used for assembly such as die attach adhesive, wire size and composition, seal process based on device sensitivity and marking process based on device application.
Proficient in Microsoft office and AutoCAD for generating bonding diagram, reports, and analysis
Ability to work with vendors/suppliers to meet the specific requirements of the customer’s specification.
Understanding of vendors design rules and ability to relate this information to the customer when designing new packages.
5 years minimum as a Process Engineer or applicable experience.
BS/MS Degree in Engineering or Technical Field
This position is open to U.S. citizens by birth or naturalization and U.S. nationals.
Qualified candidates must fill out the Golden Altos Employment Application Form and send/submit with their resume to
Email to email@example.com, or FAX (408) 956-1212 — Attention: Human Resources