Summary of Position
Die Attach Operator position is in a semiconductor cleanroom assembly area. Responsibilities cover many facets of microelectronics assembly; including die and wafer processing, chip-and-wire assembly, visual inspection and sorting of semiconductor devices. Immediate responsibilities will be performing die attach on a variety of devices.
Essential Job Requirements
High degree of manual dexterity while using a microscope.
Knowledge of basic semiconductor assembly equipment.
Ability to learn the operation of complex equipment with special training.
Proper handling of delicate hardware and materials with small tools like tweezers and small tipped vacuum wands.
Ability to maintain (with high-level standards for accuracy) data recording, lot traceability, and machine logs.
In addition, this position has a strong potential to progress into a team lead. At that time, the role could include responsibilities for progress reporting and additional interaction with other departments like Quality Control and Production Control. Prior experience in a lead role will be beneficial.
High School diploma
Microelectronics assembly experience (related to MIL-STD-883, MIL-PRF-38534 and/or MIL-PRF-38535) is essential.
Five years minimum experience in a cleanroom assembly environment is required.
Experience in a lead role organizing work for others and supervising daily progress is also preferred.
Microelectronics assembly (related to MIL-PRF-38535 and MIL-STD-883) experience is essential.
The use of a microscope is required for up to 8 hours per day.
Must be able to stand for up to 4 hours per day while running certain equipment.
Must be able to operate complex assembly and wafer processing equipment after specialized training.
This position is open to U.S. citizens by birth or naturalization and U.S. nationals.
Qualified candidates must fill out the Golden Altos Employment Application Form and send/submit with their resume to:
Email to email@example.com, or FAX (408) 956-1212 — Attention: Human Resources