Golden Altos Corporation
Serving the semiconductor, military and aerospace industries since 1984

Wire Bonding Capabilities

Wire Bonding Capabilities

 

Golden Altos uses high-speed, fine pitch wire bonders and offers, as standard, a variety of wire types and diameters. These choices allow us to match the wire bonding to your specific needs. Whether your requirements are high current, high frequency or anything in between, Golden Altos has a solution for you.

  • Aluminum Wedge Bonding

    • Wire Diameters: 0.7, 1.0, 1.25, 1.5, 2, 3, 5, 10, 15 mils

  • Gold Ball / Wedge Bonding

    • Wire Diameters: 0.7, 1.0, 1.25 mils