Golden Altos Corporation
Serving the semiconductor, military and aerospace industries since 1984

Die Attach Process

Die Attach Process

 

Golden Altos uses state-of-the-art Die Attach equipment for Silver Glass die attach material in order to optimize die planarity and maintain consistent Bond Line Thickness (BLT) on every unit processed.

  • Golden Altos will also use a DESC approved Cyanate Ester (JM7000) die attach material as an alternative to silver glass for use with solder sealed or welded hermetic packages.

  • For builds requiring eutectic die attach, Golden Altos employs workers skilled in this art.