Golden Altos Corporation
Serving the semiconductor, military and aerospace industries since 1984

Die Attach Material

Die Attach Material

 

Silver Glass:QMI 2569 (conductive)

  • For Glass sealed packages such as CDIP, CERQUAD, PGA, etc.

  • For Gold Tin sealed packages such as LCC, LLCC, CQFP, PGA, Ceramic SOIC, etc.

Silver Filled Cyanate Ester:JM 7000 & QMI 301 (conductive)

  • For co-fired packages only such as LCC, LLCC, CQFP, PGA, Ceramic SOIC, etc.

Other Adhesives

  • Silver filled epoxy

  • Electrically insulating (non-conductive) epoxy

Eutectic

  • 2% Silicon / 98% Gold preform

  • 80% Gold / 20% Tin preform