Golden Altos Corporation
Serving the semiconductor, military and aerospace industries since 1984

Assembly Testing

Assembly Testing


Quality conformance Military Test Flows Capability includes:

  • Die Shear/Stud Pull Strength

  • Bond Strength

  • Constant Acceleration (Centrifuge)

  • Particle Impact Noise Detection (PIND) for Class S

  • External Visual

  • Substrate Attach Strength

  • Seal

    • Fine Leak

    • Gross Leak

  • Temperature Cycling

  • Solderability

  • Resistance to Solvents

  • Non-Destructive Bond Pull for Class S

  • Lid Torque for glass-sealed packages