• Company Profile
• Device Assembly
  • Packages
  • Assembly
  • Process Flows
• Burn-In Services
  • Board Design
  • Board Manufacturing
  • Environmental Options
• Screening Qualification
  • MIL-STD-883
  • JEDEC-STD-22
• Program Management
• Request Quotation

 

Request Quotation

To request a quotation for your project, you may contact us by:

 

Web Form:

Please be sure to fill out each of the Contact Information fields. We never share your personal information (see our Privacy Policy for details).

Contact Information
First Name:
Last Name:
Company:
Telephone:
E-mail:
Assembly Services
Package Type:	Select Package Type CERDIP CERPAK CHIP CARRIER/LCC CPGA CQFP FLATPACK SIDEBRAZE SOIC TO-HEADER Other
Number of Leads:	Invalid format.
Quantity:	Invalid format.
Process Flow:	Select Process Flow Engineering Prototype Commercial Military Class Q/B Military Class V/S
Turnaround Time:	(days)
Wafer Saw & Die Prep
Wafer Diameter:	(inches)
Die Size:	X by Y (mils)
Wafer Thickness:	(mils)
	Backgrinding Required? — Thickness? (mils)
Quantity of Wafers:
Turnaround Time:	(days)
Marking & Demarking
Procedure:	Select Procedure Append Mark Demark Demark & Mark Mark
Package Type:	Select Package Type CERDIP CERPAK CHIP CARRIER/LCC CPGA CQFP FLATPACK PDIP PLCC PPGA PQFP PSOIC SIDEBRAZE SOIC TO-HEADER Other
Quantity:
Turnaround Time:	(days)
Qualification Testing
Qualification Type:	Select Group Group B Group C Group D/JEDEC
Quantity:
Turnaround Time:	(days)
Burn-In Boards
Package Type:	Select Package Type CERDIP CERPAK CHIP CARRIER/LCC CPGA CQFP FLATPACK PDIP PLCC PPGA PQFP PSOIC SIDEBRAZE SOIC TO-HEADER Other
Quantity of Boards:
Turnaround Time:	(days)
Burn-In Service
Package Type:	Select Package Type CERDIP CERPAK CHIP CARRIER/LCC CPGA CQFP FLATPACK PDIP PLCC PPGA PQFP PSOIC SIDEBRAZE SOIC TO-HEADER Other
Quantity of Parts:
Turnaround Time:	(days)
Comments and/or Special Requirements: