Package Configurations

Golden Altos is experienced in assembling a wide range of package types and sizes; from 3-lead LCCs to 559-lead PGAs and nearly everything in between. We also cover a wide range of specialty hybrid packages.

We’ll work with your existing packages or Golden Altos can source packages through our ongoing relationships with recognized package manufacturers.

Golden Altos assembles a wide variety of standard ceramic and specialty packages

Standard Ceramic Packages

  • Ceramic SOIC — Small Outline Integrated Circuit
  • CERDIP — Ceramic Dual Inline Package with lead frame
    • Windowed or Non-Windowed
  • CERPAC — Ceramic Package with unformed leads on two opposite sides
  • CERQUAD —Ceramic Package with unformed leads on all four sides
    • Windowed or Non-Windowed
  • CQFP — Ceramic Quad Flat Pack with bottom leads on all four sides
  • FLATPACK — Ceramic Package with bottom leads on two opposite sides
  • JLCC — Leaded Chip Carrier with “J” bend leads
  • LCC — Leadless Chip Carrier
  • PGA —Pin Grid Array
    • Cavity Up or Down
    • With or Without Heatsinks
  • SIDEBRAZE — Ceramic Dual Inline Package with attached leads

Specialty Packages

  • COB — Chip On Board
  • FLEX CABLE — Package with integrated cable
  • HYBRID — Mixed components in same package
  • METAL TO CANS — Metal Transistor Outline Can-type package
  • MULTICHIP MODULE — Multiple Integrated Circuits in same package