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Package Configurations

Golden Altos is experienced in assembling a wide range of package types and sizes; from 8-pin DIPs to 559-pin PGAs and nearly everything in between.

In most cases customers supply their own packages, but Golden Altos can also source packages through existing relationships with recognized package manufacturers.

Standard Ceramic Packages

• Ceramic SOIC — Small Outline Integrated Circuit
  
  
• CERDIP — Ceramic Dual Inline Package with lead frame
  • Windowed or Non-Windowed
    
    
• CERPAC — Ceramic Package with unformed leads on two opposite sides
  
  
• CERQUAD — Ceramic Package with unformed leads on all four sides
  • Windowed or Non-Windowed
    
    
• CQFP — Ceramic Quad Flat Pack with bottom leads on all four sides
  
  
• FLATPACK — Ceramic Package with bottom leads on two opposite sides
  
  
• JLCC — Leaded Chip Carrier with "J" bend leads
  
  
• LCC — Leadless Chip Carrier
  
  
• PGA — Pin Grid Array
  • Cavity Up or Down
  • With or Without Heatsinks
    
    
• SIDEBRAZE — Ceramic Dual Inline Package with attached leads

 

Specialty Packages

• COB — Chip On Board
  
  
• FLEX CABLE — Package with integrated cable
  
  
• HYBRID — Mixed components in same package
  
  
• METAL or TO CANS — Metal Transistor Outline Can-type package
  
  
• MULTICHIP MODULE — Multiple Integrated Circuits in same package