MIL-STD-883 Screening / Qualification
Since March 22, 2000, Defense Logistics Agency (DSCC) has granted Golden Altos Corporation laboratory suitability.
All testing performed is compliant per test methods:
- MIL-STD-883
- MIL-PRF-38535
In addition, we are capable of testing to the following specifications:
- MIL-STD-750
- MIL-STD-202
- JEDEC-STD-22
- Bellcore
- GR486
- 1221
- 486
- 326
MIL-STD 883 Qualification Testing for Hermetically Packaged Semiconductor Devices
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Environmental Tests
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Moisture Resistance (Method 1004)
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Steady State Life (Method 1005)
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Salt Atmosphere Corrosion (Method 1009)
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Temperature Cycling (Method 1010)
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Thermal Shock (Method 1011)
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Seal, Fine and Gross Leak Test (Method 1014)
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Burn-In Test (Method 1015)
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Internal Water Vapor Content (Method 1018)
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Mechanical Tests
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Constant Acceleration (Method 2001)
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Mechanical Shock (Method 2002)
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Solderability (Method 2003)
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Lead Integrity (Method 2004)
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Vibration Variable Frequency (Method 2007)
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Bond Strength Destructive Bond Pull Test (Method 2011)
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Resistance to Solvents (Method 2015)
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Physical Dimensions (Method 2016)
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Die Shear Strength (Method 2019)
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Particle impact Noise Detection Test (Method 2020)
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Lid Torque for glass-fit-sealed packages (Method 2024)
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Adhesion of Lead Finish (Method 2025)
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Random Vibration (Method 2026)
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Group B Tests
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For Class B Devices
- Subgroup 2 — Resistance to Solvent
- Subgroup 3 — Solderability
- Subgroup 5 — Bond Strength
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For Class S Devices
- Subgroup 1 — Physical Dimension, Water Vapor Content
- Subgroup 2 — Resistance to Solvent, Internal Visual & Mechanical Bond Strength, Substrate Attach
- Subgroup 3 — Solderability
- Subgroup 4 — Lead Integrity, Fine Leak, Gross Leak, Lid Torque
- Subgroup 5 — Steady State Life
- Subgroup 6 — Temperature Cycle, Constant Acceleration, Fine Leak, Gross Leak
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Group C Tests
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Sub-group 1a
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Group D Tests
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Sub-group 1
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Sub-group 2
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Sub-group 3
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Sub-group 4
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Sub-group 5
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Sub-group 6
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Sub-group 7
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Sub-group 8
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