JEDEC 22 Pre-Conditioning Tests

SOIC Surface Mounts DevicesThese test conditions are based on industry standard preconditioning flow for plastic surface mount devices (SMDs). It representatives typical industry multiple solder reflow operation.

Plastic SMDs should be subjected to the appropriate preconditioning sequence of this document by the semiconductor manufacturer prior to being submitted to specific in-house testing to evaluate long term reliability. The table below shows the sequence of the preconditioning tests.

Device Moisture Sensitivity Level
1
2
2a
3
4
5
5a
6
DC Electrical/functional 25°C
R
R
R
R
R
R
R
R
40x Visual Examination
R
R
R
R
R
R
R
R

Shippability (Temp Cycle 5x -40/+60°C)

O
O
O
O
O
O
O
O
Bake (125°C for 24 hours)
R
R
R
R
R
R
R
R
Moisture Soak (168 hours 85°C/85% RH)
R







(168 hours 85°C/60% RH)

R






(# = hours 30°C/60% RH)
TOL=Time On Label



R
696
R
192
R
96
R
72
R
48

R
TOL

Solder Reflow
R
R
R
R
R
R
R
R
Flux Immersion (10 seconds minimum)
R
R
R
R
R
R
R
R
Rinse in deionized water
R
R
R
R
R
R
R
R
Dry room ambient
R
R
R
R
R
R
R
R
DC Electrical/functional 25°C
R
R
R
R
R
R
R
R
Reliability
R
R
R
R
R
R
R
R
DC Electrical/functional 25°C end points
R
R
R
R
R
R
R
R

Note : R = Required , O = Optional

Solder Reflow

For Solder Reflow, Golden Altos uses the preferred equipment: a full convection reflow system capable of maintaining the required reflow profiles.