Careers

Summary of Position and Responsibilities
• Perform Solder Dip and Solderability Testing
• Perform process monitor measurements on production solder dip lots
• Vision abilities required by this job include close vision
• Maintain cleanliness of work area and equipment(s).
• Perform other responsibilities that may be assigned by Management as the business will necessitate

Required Experience:
• Knowledge of basic semiconductor assembly equipment
• Knowledge in how to use measuring equipment such as XRF and Caliper, Microscope, etc
• Candidate must be comfortable working with the various chemicals which used in the solder dip process.
• Ability to maintain (with high-level standards for accuracy) data recording, lot traceability, and machine logs.
• Experienced in performing solder dip operation, using manual and semi-automatic equipment is a plus.
• Microelectronics assembly experience (related to MIL-STD-883, MIL-PRF-38534 and/or MIL-PRF-38535) is essential

Required Education:
• High school diploma plus minimum of 3 years’ experience working with packaged semiconductor devices.
• Must be comfortable working with the various chemicals which used in the solder dip process
• Experienced in performing solder dip operation, using manual and semi-automatic equipment is a plus.

Summary of Position and Responsibilities
• Performs die attach on semiconductor devices
• Performs Die Attach cure
• Performs Eutectic Die attach to Non-Eutectic Devices.
• Performs Functional Test after Die Attach
• Visual inspection and sorting of semiconductor devices
• Perform other responsibilities that may be assigned by Management as the business will necessitate

Required Experience:
• High degree of manual dexterity while using a microscope.
• Knowledge of basic semiconductor assembly equipment.
• Ability to learn the operation of complex equipment with special training
• Proper handling of delicate hardware and materials with small tools like tweezers and small tipped vacuum wands.
• Ability to maintain (with high-level standards for accuracy) data recording, lot traceability, and machine logs
• Microelectronics assembly (related to MIL-PRF-38535 and MIL-STD-883) experience is essential.

Required Education:
• High School diploma

Summary of Position and Responsibilities
• Set-up and operate all wire bond machine accordance with the machine vendor’s operation or Maintenance Manual
• Perform Bonding procedure
• Visual inspection.
• Follows Job Traveler instructions accurately
• Perform other responsibilities that may be assigned by Management as the business will necessitate

Required Experience:
• Knowledge of basic semiconductor assembly equipment.
• High degree of manual dexterity while using a microscope
• Ability to meet quality goals, safety requirements, and follow company policies.
• Ability to maintain (with high-level standards for accuracy) data recording, lot traceability, and machine logs
• Experience with wire pull machines
• Microelectronics assembly experience (related to MIL-STD-883, MIL-PRF-38534 and/or MIL-PRF-38535) is essential.

Required Education:
• High school diploma

Summary of Position and Responsibilities
• Responsible for the setup of machine before using.
• Perform all sealing, vacuum sealing and dry packing for Gold – Tin Eutectic Hermetic Seal
• Perform the procedure for Frame Attach and Glass Seal
• Responsible in ensuring the sealing conforms with applicable specification and procedure.
• Perform other responsibilities that may be assigned by Management as the business will necessitate

Required Experience:
• Knowledge of basic semiconductor assembly equipment.
• Ability to maintain (with high-level standards for accuracy) data recording, lot traceability, and machine logs.
• Microelectronics assembly experience (related to MIL-STD-883, MIL-PRF-38534 and/or MIL-PRF-38535) is essential.

Required Education:
• High School diploma

Summary of Position and Responsibilities
• Perform visual inspection, labeling and sorting of semiconductor devices
• Perform pre-cap visual die and bond wire inspection.
• Perform inspection of all wire bonded device, verifying the conformity of the device to the bonding diagram.
• Perform other responsibilities that may be assigned by Management as the business will necessitate

Required Experience:
• High degree of manual dexterity while using a microscope.
• Knowledge of basic semiconductor assembly equipment.
• Ability to learn the operation of complex equipment with special training.
• Proper handling of delicate hardware and materials with small tools like tweezers and small tipped vacuum wands.
• Ability to maintain (with high-level standards for accuracy) data recording, lot traceability, and machine logs.
• Microelectronics assembly experience (related to MIL-STD-883, MIL-PRF-38534 and/or MIL-PRF-38535) is essential.

Required Education:
• High School diploma

Summary of Position and Responsibilities
• Responsible in separation of silicon dice into individual die by sawing through the wafers at the street intersections.
• Perform other responsibilities that may be assigned by Management as the business will necessitate

Required Experience:
• Knowledge of basic semiconductor assembly equipment.
• Ability to learn the operation of complex equipment with special training.
• Ability to maintain (with high-level standards for accuracy) data recording, lot traceability, and machine logs.
• Microelectronics assembly experience (related to MIL-STD-883, MIL-PRF-38534 and/or MIL-PRF-38535) is essential.

Required Education:
• High School diploma

Summary of Position and Responsibilities
• Perform Wire Bond Strength Test
• Perform Destructive Bond Pull Test
• Perform the Nondestructive Bond Pull
• Perform other responsibilities that may be assigned by Management as the business will necessitate

Required Experience:
• Knowledge of basic semiconductor assembly equipment.
• Ability to learn the operation of complex equipment with special training.
• Ability to maintain (with high-level standards for accuracy) data recording, lot traceability, and machine logs.
• Microelectronics assembly experience (related to MIL-STD-883, MIL-PRF-38534 and/or MIL-PRF-38535) is essential.

Required Education:
• High School diploma

Summary of Position and Responsibilities
• Set up, operate and maintain welding equipment
• Performs all weld preparation
• Tack weld and weld components
• Responsible in seam seal welding process of hermetic packages
• Perform other responsibilities that may be assigned by Management as the business will necessitate

Required Experience:
• Knowledge of basic semiconductor hand tools and experienced with weld equipment
• Ability to learn the operation of complex equipment with special training.
• Ability to maintain (with high-level standards for accuracy) data recording, lot traceability, and machine logs.
• Microelectronics assembly experience (related to MIL-STD-883, MIL-PRF-38534 and/or MIL-PRF-38535) is essential

Required Education:
• High School diploma

Summary of Position and Responsibilities
• Set-up and operation of die attach machine and wire bond machine with speed and accuracy for processing and testing high volumes of parts
• Perform maintenance as needed to keep both the wire bond and die attach machines running properly
• Inspect all bonded parts
• Identify and report process deviations to Manager.
• Will be responsible for ensuring quality of work
• Perform other responsibilities that may be assigned by Management as the business will necessitate

Required Experience:
• Knowledge of basic semiconductor assembly equipment.
• High degree of manual dexterity while using a microscope
• Ability to meet quality goals, safety requirements, and follow company policies.
• Ability to maintain (with high-level standards for accuracy) data recording, lot traceability, and machine logs
• Strong inspection skills (must be able to pay close attention to details)
• Experience in setting up and running automated wire bonding equipment.
• Microelectronics assembly experience (related to MIL-STD-883, MIL-PRF-38534 and/or MIL-PRF-38535) is essential.
• Previous manufacturing/assembly experience preferred

Required Education:
• High School Diploma

Summary of Position and Responsibilities
• Set up, operate and maintain machine for marking
• Responsible in ensuring the marking conforms with the required specifications and procedures
• Responsible in curing procedure for semiconductor devices and packages
• Perform other responsibilities that may be assigned by Management as the business will necessitate

Required Experience:
• Knowledge of basic semiconductor assembly equipment.
• Ability to maintain (with high-level standards for accuracy) data recording, lot traceability, and machine logs.
• Microelectronics assembly experience (related to MIL-STD-883, MIL-PRF-38534 and/or MIL-PRF-38535) is essential

Required Education:
• High School diploma

Summary of Position and Responsibilities
• Operate Centrifuge machine
• Perform lead trim by following customer requirement.
• Oversee Backend operator’s performance
• Perform other responsibilities that may be assigned by Management as the business will necessitate

Required Experience:
• Knowledge of basic semiconductor assembly equipment
• Ability to learn the operation of complex equipment with special training.
• Proper handling of delicate hardware and materials with small tools.
• Ability to maintain (with high-level standards for accuracy) data recording, lot traceability, and machine logs.
• Microelectronics assembly experience (related to MIL-STD-883, MIL-PRF-38534 and/or MIL-PRF-38535) is essential.

Required Education:
• High School Diploma

Summary of Position and Responsibilities
• Final QC buy off. Check the traveler to see, is there any missing process or missing document.
• Verify QTY and quality by taking samples
• Pack the units and transfer to shipping area.

Required Experience:
• Knowledge of basic semiconductor assembly equipment
• Ability to learn the operation of complex equipment with special training.
• Proper handling of delicate hardware and materials with small tools.
• Ability to maintain (with high-level standards for accuracy) data recording, lot traceability, and machine logs.
• Microelectronics assembly experience (related to MIL-STD-883, MIL-PRF-38534 and/or MIL-PRF-38535) is essential

Required Education:
• High School Diploma

Summary of Position and Responsibilities
• Support supervisor to oversee swing shift front line operator’s performance
• Responsible in the inspection of the bonded parts.
• Perform other responsibilities that may be assigned by Management as the business will necessitate

Required Experience:
• Knowledge of basic semiconductor assembly equipment
• Ability to learn the operation of complex equipment with special training.
• Proper handling of delicate hardware and materials with small tools.
• Ability to maintain (with high-level standards for accuracy) data recording, lot traceability, and machine logs.
• Microelectronics assembly experience (related to MIL-STD-883, MIL-PRF-38534 and/or MIL-PRF-38535) is essential.

Required Education:
• High School Diploma

Summary of Position and Responsibilities
• Final QC Buy off
• Checking of Traveler to ensure the completeness and accuracy of process and documents.
• Verifying the completeness of quantity.
• Verifying the quality through batch sampling
• Responsible in packaging the units and transferring to the shipping area.        • Perform other responsibilities that may be assigned by Management as the business will necessitate.

Required Experience:

• High degree of manual dexterity while using a microscope.
• Knowledge of basic semiconductor assembly equipment.
• Ability to learn the operation of complex equipment with special training.
• Proper handling of delicate hardware and materials with small tools like tweezers and small tipped vacuum wands.
• Ability to maintain (with high-level standards for accuracy) data recording, lot traceability, and machine logs.
• Microelectronics assembly experience (related to MIL-STD-883, MIL-PRF-38534 and/or MIL-PRF-38535) is essential.

Required Education:
• High School Diploma

Summary of Position and Responsibilities
• Perform Fine Leak/Gross Leak and PIND Testing operations.
• Pressurize parts for leak testing
• Responsibilities in determining the effectiveness of the sealing process

Required Experience:
• Knowledge of basic semiconductor assembly equipment
• Ability to learn the operation of complex equipment with special training.
• Proper handling of delicate hardware and materials with small tools.
• Ability to maintain (with high-level standards for accuracy) data recording, lot traceability, and machine logs.
• Microelectronics assembly experience (related to MIL-STD-883, MIL-PRF-38534 and/or MIL-PRF-38535) is essential.

Required Education:
• High School Diploma

Summary of Position and Responsibilities     

• Responsible in maintaining the cleanrooms and associated controlled environment.
• Clean and perform Preventive Maintenance for equipment on regular basis
• Maintain the work areas and equipment clean, safe and organized together with production/machine technician and operators.
• Perform In-house calibration as specified in this calibration procedure and to arrange for outside calibration standards and other test/measuring equipment as required.
• Repair malfunctioning equipment units and broken structures
• Assist in equipment troubleshooting and in root cause analysis of equipment failures and propose corrective actions
• Perform electrical systems maintenance if certified to perform
• Inspect and maintain safety and alarm systems
• Quality check equipment regularly to ensure everything is in working order
• Create inspection and repair schedules
• Perform administrative task such as completion of Daily Facility applicable logs.
• Maintain, Update and Review Calibration Database.
• Perform other responsibilities that may be assigned by Management as the business will necessitate

Required Experience:
• Knowledge of electrical, plumbing and light repair of equipment and facilities essential for the position.
• Knowledge of basic semiconductor assembly equipment
• Ability to communicate and direct requirements effectively with equipment manufactures/suppliers.
• Safety minded, and attention to detail when working and completing paperwork.
• Must have hand-on and technical skills
• Electrical experience or license – essential advantage
• Semiconductor experience a plus

Required Education:
• BS/MS Degree in Engineering or Technical Field or 3 years of utilities and facilities maintenance experience

Summary of Position and Responsibilities   

• Responsible for new equipment set-up and installations, assembly equipment maintenance, troubleshooting and improvement
• Responsible in performing the full equipment qualification in accordance with applicable production specifications and test method and procedures.
• Ensure that all equipment’s are shutdown/power up according to the equipment manual and/or engineering dispositions.
• Responsible for equipment issue and troubleshooting and executive preventive counter measures.
• Responsible for monitoring the efficiency and performance of the equipment.
• Establish, review and revise the SOP for trouble shooting, prevention, proper equipment operation and maintenance
• Able to lead in yield improvement, cost reduction activities and cycle time reduction projects
• Work closely with Process Engineers to monitor and improve the process capability.
• Ensure the Equipment at the optimum level and qualify to minimize the requirement
• Perform other responsibilities that may be assigned by Management as the business will necessitate

Required Experience:
• Knowledge of basic semiconductor assembly equipment
• working experience in tools and maintenance in semiconductor industry is advantage
• Possess good communication skills and able to work independently with minimal supervision
• Able to work in cleanroom environment and perform overtime as and when necessary

Required Education:
• Degree/Master in Material Science, Electronics or Mechanical Engineering

Summary of Position and Responsibilities 

• Receiving and incoming inspection
• Prepares shipments and their proper documents
• Receiving of all materials in a timely manner and to distribute the paperwork and or material to the appropriate departments.
• Responsible in the completion of the applicable log related to Receiving and Shipping
• Contact carriers and schedule shipments
• Initiate Nonconforming Material Report and coordinate the appropriate follow up
• Initiate deviations and coordinate proper follow up
• Inventory control
• Stock and organize inventory
• Physical and cycle inventory counts
• Documents damages and discrepancies for future reimbursement and reconciliation
• Perform other responsibilities that may be assigned by Management as the business will necessitate.

Required Experience:

• Knowledge of basic semiconductor assembly materials and finish products
• Receiving, or Shipping experience is preferred.
• Basic math skills and computer skills.
• Attention to detail & problem-solving skills required.
• Ability to follow written &verbal procedures and directions
• Organization skills and the ability to prioritize one’s work.
• Capable of cross training (learning more than one job or operation) and multi-tasking.
• Innovative and motivated team player to work in an area with a continuous improvement mindset

Required Education:

• High School Diploma or equivalent.