Golden Altos provides packaging services for engineering, prototyping, and production products. Our military and space level packaging conforms to MIL-PRF-38535 requirements for monolithic devices and MIL-PRF-38534 for hybrids and MCMs.
Golden Altos uses state-of-the-art Die Attach equipment for Silver Glass die attach material in order to optimize die planarity and maintain consistent Bond Line Thickness (BLT) on every unit processed.
Golden Altos will also use a DESC approved Cyanate Ester (JM7000) die attach material as an alternative to silver glass for use with solder sealed or welded hermetic packages.
For builds requiring eutectic die attach, Golden Altos employs workers skilled in this art.
Wire Bonding Capabilities
Golden Altos uses high-speed, fine-pitch wire bonders and offers, as standard, a variety of wire types and diameters. These choices allow us to match the wire bonding to your specific needs. Whether your requirements are high current, high frequency, or anything in between, Golden Altos has a solution for you.
Aluminum Wedge Bonding
Wire Diameter (mils)
0.70, 1.0, 1.25, 2.0, 3.0, 5.0, 10, 15
Gold Ball / Wedge Bonding
Wire Diameter (mils)
0.70, 1.0, 1.25
Ribbon Bonding
Wire Diameter (mils)
0.25 mils x 1.4 mils up to 2 mils x 10 mils
Sealing and Encapsulation
Golden Altos offers both Solder Sealing (Gold-Tin Eutectic) and Glass Sealing processes for ceramic packages.
Parallel Seam Sealing
Wide Range of Hybrid
MCM Packages
Resistance Welding
TO-3
TO-5
TO-8
TO-39
TO-46
TO-100
Residual gases (from sealed cavity parts) are regularly monitored to ensure long-term reliability.
For certain requirements, Golden Altos can “glob top” with encapsulation material suitable for non-hermetic custom packages.
Assembly Testing
Quality conformance Military Test Flows Capability includes:
Die Shear/Stud Pull Strength
Bond Strength
Constant Acceleration (Centrifuge)
Particle Impact Noise Detection (PIND)
Class S
External Visual
Substrate Attach Strength
Seal
Fine Leak
Gross Leak
Temperature Cycling
Solderability
Resistance to Solvents
Non-Destructive Bond Pull
Class S
Lid Torque
Glass-sealed packages
Marking
Golden Altos used industry standard inks to mark devices.
We mark on ceramic, plastic, gold lids or other metals.
Our marking and curing is compliant with MIL-STD-883 Method 2015 for Resistance to Solvents (Mark Permanency).
In addition to standard part marking, serialization is also available.
Lead Finish
For packages requiring lead finishing, Golden Altos offers hot solder dipping using (Tin/Lead) composition solder.
Leaded
Sn63/Pb37
Lead Free
Sn96.5/Ag3.0/Cu0.5
Additional Services
Saw & Plate
Wafer size up to 12 inches
Returned on the sticky film frame or in waffle packs