Assembly Capabilities

Golden Altos offers complete on-shore, in-house, hermetic, high-reliability assembly including all quality conformance testing for MIL-STD-883 and MIL-PRF-38535 requirements. For hybrids and MCMs, we currently build to the MIL-PRF-38534 standard.

Specific Materials, Processes and Capabilities

Die Attach Material

Silver Glass:QMI 2569 (conductive)

  • For Glass sealed packages such as CDIP, CERQUAD, PGA, etc.
  • For Gold Tin sealed packages such as LCC, LLCC, CQFP, PGA, Ceramic SOIC, etc.

Silver Filled Cyanate Ester:JM 7000 & QMI 301 (conductive)

  • For co-fired packages only such as LCC, LLCC, CQFP, PGA, Ceramic SOIC, etc.

Other Adhesives

  • Silver filled epoxy
  • Electrically insulating (non-conductive) epoxy


  • 2% Silicon / 98% Gold preform
  • 80% Gold / 20% Tin preform

Die Attach Process

  • Golden Altos uses state-of-the-art Die Attach equipment for Silver Glass die attach material in order to optimize die planarity and maintain consistent Bond Line Thickness (BLT) on every unit processed.
  • Golden Altos will also use a DESC approved Cyanate Ester (JM7000) die attach material as an alternative to silver glass for use with solder sealed or welded hermetic packages.
  • For builds requiring eutectic die attach, Golden Altos employs workers skilled in this art.

Wire Bonding Capabilities

  • Golden Altos uses high-speed, fine pitch wire bonders and offers, as standard, a variety of wire types and diameters. These choices allow us to match the wire bonding to your specific needs. Whether your requirements are high current, high frequency or anything in between, Golden Altos has a solution for you.
  • Aluminum Wedge Bonding
    • Wire Diameters: 0.7, 1.0, 1.25, 1.5, 2, 3, 5, 10, 15 mils
  • Gold Ball / Wedge Bonding
    • Wire Diameters: 0.7, 1.0, 1.25 mils

Sealing & Encapsulation

  • Golden Altos offers both Solder Sealing (Gold-Tin Eutectic) and Glass Sealing processes for ceramic packages.
  • We perform parallel seam sealing on a wide range of hybrid and MCM packages.
  • Golden Altos also offers Resistance Welding for Metal Cans such as TO-3, TO-5, TO-8, TO-100, and other metal can configuration.
  • Residual gases (from sealed cavity parts) are regularly monitored to ensure long-term reliability.
  • For certain requirements, Golden Altos can “glob top” with encapsulation material suitable for non-hermetic custom packages.

Assembly Testing

Quality conformance Military Test Flows Capability includes:

  • Die Shear/Stud Pull Strength
  • Bond Strength
  • Constant Acceleration (Centrifuge)
  • Particle Impact Noise Detection (PIND) for Class S
  • External Visual
  • Substrate Attach Strength
  • Seal
    • Fine Leak
    • Gross Leak
  • Temperature Cycling
  • Solderability
  • Resistance to Solvents
  • Non-Destructive Bond Pull for Class S
  • Lid Torque for glass-sealed packages


  • Golden Altos used industry standard inks to mark devices. We mark on ceramic, plastic, gold lids or other metals. Our marking and curing is compliant with MIL standards for Resistance to Solvents (Mark Permanency).
  • In addition to standard part marking, serialization is also available.

Lead Finish

  • For packages requiring lead finishing, Golden Altos offers hot solder dipping using Sn60Pb40 (Tin/Lead) composition solder.

Additional Services

Saw & Plate

  • Wafer size up to 12 inches
  • Returned on the sticky film frame or in waffle packs

Saw, Plate & 2nd Optical Visual

  • Military
  • Commercial

Tape Lids

  • For quick turn engineering prototyping
  • Includes saw, plate, visual, wire bond and tape lid/cap

Demark & Remark

  • Demarking can be Black Top, Mechanical Eraser or Chemical removal

Add Mark

  • Add additional marking to existing mark