Assembly Capabilities
Golden Altos offers complete in-house, hermetic, high-reliability assembly including all quality conformance testing for MIL-STD-883 and MIL-PRF-38535 requirements.
Specific materials, processes and capabilities are:
- Die Attach Material
- Die Attach Process
- Sealing and Encapsulation
- Assembly Testing
- Marking
- Lead Finish
- Additional Services
Die Attach Material
- Silver Glass: QMI 2569 (conductive)
- For Glass sealed packages such as CDIP, CERQUAD, PGA, etc.
- For Gold Tin sealed packages such as LCC, LLCC, CQFP, PGA, Ceramic SOIC, etc.
- Silver Filled Cyanate Ester: JM 7000 & QMI 301 (conductive)
- For co-fired packages only such as LCC, LLCC, CQFP, PGA, Ceramic SOIC, etc.
- Other Adhesives:
- Silver filled epoxy
- Electrically Insulating epoxy
- Eutectic:
- 2% Silicon / 98% Gold preform
- 80% Gold / 20% Tin preform
Die Attach Process
- Golden Altos uses a state of the art Die Bonding equipment for Silver GLASS material in order to optimize die planarity and maintain consistent Bond Line Thickness on every unit processed.
Sealing and Encapsulation
- We offer both Solder Sealing (Gold-Tin Eutectic) and Glass Sealing techniques which we guarantee a residual gas of less than 5000 ppm moisture.
- Golden Altos also offer Resistance Welding for Metal Cans such as TO-3, TO-5, TO-8, TO-100, and other metal can configuration.
- We also perform Glob Topping with Hysol material on custom packages.
Assembly Testing
Quality conformance Military Test Flows Capability includes:
- Die Shear Strength
- Bond Strength
- Constant Acceleration (Centrifuge)
- Particle Impact Noise Detection (PIND) for Class S
- External Visual
- Substrate Attach Strength
- Seal
- Fine Leak
- Gross Leak
- Temperature Cycling
- Solderability
- Resistance to Solvents
- Non-Destructive Bond Pull for Class S
- Lid Torque for glass-sealed packages
Marking
- We mark on ceramic, plastic, gold lids or other metals. Our marking and curing is compliant with MIL standards for Resistance to Solvents (Mark Permanency)
Lead Finish
- Golden Altos offer solder dip using Sn60Pb40 composition solder.
Additional Services
- Saw & Plate
- Wafer size up to 8"
- Returned on the sticky film frame or in waffle packs
- Saw, Plate & 2nd Optical Visual
- Military
- Commercial
- Tape Lids
- For quick turn engineering prototyping
- Includes saw, plate, visual, wire bond and tape lid/cap
- Demark & Remark
- Demarking can be Black Top, Mechanical Eraser or Chemical
- Demarking can be Black Top, Mechanical Eraser or Chemical
- Add Mark
- Add additional marking to existing mark